PCB Design

9.

High-Speed Design Principles

9.1.

Signal Integrity Fundamentals

9.1.1.

Signal Integrity Definition

9.1.2.

Frequency Domain Analysis

9.1.3.

Time Domain Analysis

9.1.4.

Signal Quality Metrics

9.2.

Transmission Line Theory

9.2.1.

Transmission Line Models

9.2.2.

Characteristic Impedance

9.2.3.

Propagation Delay

9.2.4.

Loss Mechanisms

9.3.

Impedance Control

9.3.1.

Microstrip Configurations

9.3.1.1.

Surface Microstrip

9.3.1.2.

Embedded Microstrip

9.3.1.3.

Impedance Calculations

9.3.2.

Stripline Configurations

9.3.2.1.

Symmetric Stripline

9.3.2.2.

Asymmetric Stripline

9.3.2.3.

Impedance Calculations

9.3.3.

Differential Impedance

9.3.3.1.

Differential Pair Geometry

9.3.3.2.

Odd Mode Impedance

9.3.3.3.

Even Mode Impedance

9.4.

Signal Integrity Issues

9.4.1.

9.4.1.1.

Causes of Reflections

9.4.1.2.

Reflection Coefficient

9.4.1.3.

Standing Wave Patterns

9.4.2.

9.4.2.1.

Near-End Crosstalk

9.4.2.2.

Far-End Crosstalk

9.4.2.3.

Crosstalk Reduction Techniques

9.4.3.

Ringing and Overshoot

9.4.3.1.

Causes and Effects

9.4.3.2.

Damping Techniques

9.4.4.

9.4.4.1.

Simultaneous Switching Noise

9.4.4.2.

Ground Bounce Reduction

9.5.

Termination Strategies

9.5.1.

Series Termination

9.5.1.1.

9.5.1.2.

Advantages and Limitations

9.5.2.

Parallel Termination

9.5.2.1.

9.5.2.2.

Power Considerations

9.5.3.

9.5.4.

Differential Termination

9.6.

Timing Analysis

9.6.1.

Propagation Delay Calculations

9.6.2.

9.6.3.

Setup and Hold Time Considerations

9.6.4.

Length Matching Requirements

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10. Electromagnetic Compatibility Design