Embedded Systems Security and Reverse Engineering

Hardware Reverse Engineering and Analysis

2.1.

Device Teardown and Component Identification

2.1.1.

Non-Destructive Analysis Techniques

2.1.1.1.

External Examination Methods

2.1.1.1.1.

Casing and Enclosure Analysis

2.1.1.1.2.

Identifying Tamper Evidence

2.1.1.1.3.

Safe Opening Techniques

2.1.1.2.

Interface and Port Identification

2.1.1.2.1.

Visual Inspection Methods

2.1.1.2.2.

Connector Type Identification

2.1.1.2.3.

Pinout Discovery Techniques

2.1.1.3.

Component Marking Analysis

2.1.1.3.1.

IC Part Number Identification

2.1.1.3.2.

Date Code Interpretation

2.1.1.3.3.

Manufacturer Identification

2.1.2.

Destructive Analysis Methods

2.1.2.1.

IC Depackaging Techniques

2.1.2.1.1.

Chemical Depackaging

2.1.2.1.2.

Mechanical Depackaging

2.1.2.1.3.

Thermal Depackaging

2.1.2.2.

Die Analysis Methods

2.1.2.2.1.

Delayering Techniques

2.1.2.2.2.

Microscopy Analysis

2.1.2.2.3.

Probing Techniques

2.1.3.

Key Component Identification

2.1.3.1.

Processing Units

2.1.3.1.1.

Microcontrollers

2.1.3.1.2.

Microprocessors

2.1.3.1.3.

Digital Signal Processors

2.1.3.1.4.

Application-Specific Processors

2.1.3.2.

2.1.3.2.1.

2.1.3.2.2.

2.1.3.2.3.

2.1.3.2.4.

One-Time Programmable Memory

2.1.3.3.

Communication Components

2.1.3.3.1.

Wi-Fi Modules

2.1.3.3.2.

Bluetooth Modules

2.1.3.3.3.

Cellular Communication Modules

2.1.3.3.4.

Ethernet Controllers

2.1.3.4.

Power Management Components

2.1.3.4.1.

Power Management ICs

2.1.3.4.2.

Voltage Regulators

2.1.3.4.3.

Battery Management Systems

2.1.3.5.

Sensors and Actuators

2.1.3.5.1.

Environmental Sensors

2.1.3.5.2.

Motion Sensors

2.1.3.5.3.

Actuator Controllers

2.2.

Accessing Hardware Interfaces

2.2.1.

Serial and Debug Interface Access

2.2.1.1.

UART Interface Analysis

2.2.1.1.1.

Pinout Discovery Methods

2.2.1.1.2.

Baud Rate Detection Techniques

2.2.1.1.3.

Protocol Analysis

2.2.1.1.4.

Data Capture Methods

2.2.1.2.

JTAG Interface Exploitation

2.2.1.2.1.

JTAG Pinout Identification

2.2.1.2.2.

Boundary Scan Analysis

2.2.1.2.3.

Debug Access Methods

2.2.1.2.4.

JTAG Security Feature Bypass

2.2.1.3.

Serial Wire Debug Access

2.2.1.3.1.

SWD Protocol Fundamentals

2.2.1.3.2.

SWD Pinout Identification

2.2.1.3.3.

Debug Session Establishment

2.2.2.

Communication Bus Analysis

2.2.2.1.

I2C Bus Interception

2.2.2.1.1.

I2C Protocol Fundamentals

2.2.2.1.2.

Bus Sniffing Techniques

2.2.2.1.3.

Command Injection Methods

2.2.2.1.4.

Device Enumeration

2.2.2.2.

SPI Bus Analysis

2.2.2.2.1.

SPI Protocol Basics

2.2.2.2.2.

Signal Capture Methods

2.2.2.2.3.

Data Injection Techniques

2.2.2.2.4.

Chip Select Analysis

2.2.2.3.

CAN Bus Security

2.2.2.3.1.

CAN Protocol Fundamentals

2.2.2.3.2.

Message Sniffing

2.2.2.3.3.

Message Injection

2.2.2.3.4.

Automotive CAN Applications

2.2.2.4.

USB Interface Analysis

2.2.2.4.1.

USB Protocol Analysis

2.2.2.4.2.

Device Enumeration

2.2.2.4.3.

Traffic Capture Methods

2.3.

Memory and Firmware Extraction

2.3.1.

On-board Memory Reading Techniques

2.3.1.1.

In-Circuit Programming Methods

2.3.1.1.1.

Bus Pirate Usage

2.3.1.1.2.

Logic Analyzer Applications

2.3.1.1.3.

Dedicated Programmer Tools

2.3.1.2.

Chip-off Extraction Methods

2.3.1.2.1.

Component Desoldering Techniques

2.3.1.2.2.

External Programmer Usage

2.3.1.2.3.

Socket Adaptation Methods

2.3.1.3.

Debug Interface Memory Access

2.3.1.3.1.

JTAG Memory Dumping

2.3.1.3.2.

SWD Memory Access

2.3.1.3.3.

Bootloader Exploitation

2.3.2.

Firmware Interception Methods

2.3.2.1.

Network-based Firmware Capture

2.3.2.1.1.

Man-in-the-Middle Attacks

2.3.2.1.2.

Network Traffic Analysis

2.3.2.1.3.

Protocol Reverse Engineering

2.3.2.2.

Over-the-Air Update Interception

2.3.2.2.1.

Wireless Traffic Capture

2.3.2.2.2.

Update Payload Extraction

2.3.2.2.3.

Update Mechanism Analysis

1. Introduction to Embedded Systems Security

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3. Firmware Reverse Engineering